LP01

Environmentally friendly components and packaging materials meet RoHS Directive restricting use of hazardous materials. Suited for lead-free soldering because of heat resistant resin materials.
Smooth, slightly concave surface of cap designed to fit fingertip. Unique design and construction of cap prevents its removal and limits tampering.

Crisp actuation and clear circuit status provided by snap-action contact mechanism. Arc barrier between movable contacts protects against crossover.

LP0115CCKW01A	LP0115CCKW01C	LP0115CCKW01F	LP0115CMKW01A	LP0115CMKW01C	LP0115CMKW01F
LP0125CCKW01A	LP0125CCKW01C	LP0125CCKW01F	LP0125CMKW01A	LP0125CMKW01C	LP0125CMKW01F